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      Technology Capability

      工藝能力

      首頁 > 服務支持 > Process ability
      Process ability
      N0. project technical indication
      1 layer number 2-12 layer (layers)
      2 working board size (maximum) 546mm*624mm
      3 plate thickness 0.2mm-3.5mm
      4 Product board thickness tolerance plate thickness 0.2mm-1.0mm + 0.1mm
      plate thickness 1.01mm-1.6mm + 0.13mm
      plate thickness 1.61mm-3.5mm + 0.15mm
      5 plate curve (minimum) = 0.7%
      6 borehole aperture 0.2mm-6.5mm
      minimum drilling TM 0.2mm, finished product aperture 0.15mm
      minimum length of long strip hole 0.6mm
      long hole aperture tolerance NPTH + 0.05mm
      long hole aperture tolerance PTH + 0.08mm
      7 , the thickness of copper at the bottom of the outer layer is 1/3oz-3oZ
      8 sheet type FR4, halogen free FR4, high TGFR4, Teflon, Rogers, CEM-3
      9 hole electroplating longitudinal and transverse ratio (maximum) 8:1
      10 aperture tolerance PTH + 0.075mm
      NPTH + 0.05mm
      11 hole wall copper thick = 18um
      12 inner line width / line distance (minimum) H/H (0.075mm/0.075mm) 1/1 (0.1mm/0.1mm); 1/1; ";"; ";"; ";"; ";"; ";"; ";" 2/2 (0.15mm/0.15mm) and
      13 outer line width / line distance (minimum) T/T (0.075mm/0.075mm)
      . H/H (0.1mm/0.1mm)
      . 1/1 (0.127mm/0.127mm)
      . 2/2 (0.178mm/0.178mm) and
      14 solder bridge width (minimum) 0.08mm
      15 external tolerance (minimum hole to edge) + 0.1mm
      16 thermal shock 288 C 10 sec (3)
      17 anti peeling strength = 1.4N/mm
      18 impedance control tolerance + 10%
      19 resistance welding layer strength > 6H
      20 surface treatment OSP, gold, lead, tin, lead-free, tin, silver, tin, carbon, blue and
      黃色A片三級三級三級无码l
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